Micro SD Card CONN;HINGED TYPE,H1.5mm & H1.8mm
Molex:5009010801 Alternative RE-C-TF-007-H1.8-R
GCT MEM2067-02-180-00-A Alternative RE-C-TF-007-H1.8-R
Material:
Insulator:Hi-Temperature Plastic,UL94V-0.Black.
Terminal:Copper Alloy.AU Plating on all terminal contact area,and tin plating on solder tail area.
Shell:Stainless Steel.
Electrical:
Current Rating:0.5 A
Voltage Rating:5.0 vrms
Insulation Resistance:1000MΩ Min./500V DC
Withstanding Voltage:250V AC For 1 minute.
Contact Resistance:100mΩ Max.AT 10mA/20mV Max
Operating Temperature: -45ºC~+105ºC
Mating Cycles:10000 Insertions.
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