EN
Features
-38-position high-density design supports QSFP+ high-speed optical module integration
-15U gold plating ensures excellent conductivity and enhanced corrosion resistance
-Surface mount structure enables efficient automated assembly and compact PCB layout
-Excellent EMI shielding performance ensures stable signal integrity in high-speed data transmission systems
Applications
1.Data Center High-Speed Networking Systems
2.Cloud Computing Infrastructure
3.Telecommunication Equipment
4.Enterprise Switches and Routers
Specifications
Material :
HOUSING: HIGH TEMERATURE LCP, BLACK, UL 94 V-0 FLAME RETARDANT.
TERMINAL :
NICKEL COPPER ALLOY
PLATING SPEC AS BELOW:
OPTION
CONTACT AREA PLATE NICKEL 2.54um MIN, PLATE Gold 0.76um MIN
SOLDER AREA PLATE NICKEL 2.54um MIN, PLATE MATT TIN 2.54~5.09um
ELELCTRICAL CHARACTERISTICS :
CONTACT CURRENT RATING: 0.5AMPERE
VOLTAGE RATING: 30VAC
CONTACT RESISTACE: 40 MILLOHMS MAX
DIELECTRIC WITHSTANDING VOLTAGE: 300VDC
ENVIRONMEENT :
OPERATION TEMPERATURE: -20° C ~ 85° C
Technical Documents
Please contact us for more information.
QSFP+ 38Pos SMD Connector 15U Gold :RHTLYSFP+01