EN
Features
-Supports high-speed optical signal transmission for modern networking applications
-Compact SFP design enables efficient high-density PCB and module integration
-Excellent EMI shielding improves signal stability and reduces interference
-Robust mechanical structure ensures long-term reliability in data center environments
Applications
1.Data Center Networking Systems
2.Telecommunication Equipment
3.Enterprise Switches and Routers
4.High-Speed Fiber Optic Communication Systems
Specifications
MECHANICAL :
CAGES: NICKEL SILVER ALLOY, THICKNESS 0.25MM.
CONNECTOR HOUSING: GLASS FILLED PLASTIC, 94 V-0, COLOR: BLACK.
OVERMOLDED TERMINAL HOUSING: GLASS FILLED PLASTIC, 94 V-0, COLOR: BLACK.
LIGHTPIPES: POLYCARBONITE, 94 V-0, COLOR: CLEAR.
LIGHTPIPE HOLDER: GLASS FILLED PLASTIC, 94 V-0, COLOR: BLACK.
CLIP: STAINLESS STEEL.
EMI SPRING: COPPER ALLOY.
TERMINAL: POSPHRR BRONZE.
GOLD PLATING FOR CONTACT AREA, THICKNESS SEE OPTION.
TIN PLATING FOR PRESS FIT AREA.
NICKEL PL ATING AS UNDERL AYER FOR WHOLE TERMINAL.
ELECTRICAL :
VOLTAGE: 30 VOLTS AC;
CURRENT: 0.50 A PER CONTACT;
CONTACT RESISTANCE: 50 MIL LIOHMS MAX;
INSUL ATION RESISTANCE: 1000 MEGAOHMS MIN AT 100 VDC FOR 1 MINUTE;
DIELECTRIC WITHSTANDING VOLTAGE: 300 VDC MIN.
TEMPERATURE :
OPERATION: -40℃ ~+85℃.
STORAGE: -55°C ~+105℃.
LIGHTPIPE PAD LAYOUT IS FOR L OW-PROFILE LED PACKAGE.
LED SIZE(LxWxH): 2x1x0.4MM MAX.
RoHS COMPLIANCE.
Technical Documents
Please contact us for more information.
SFP connector : RHTLYFP+08