EN
Features
-Compact modular design supports efficient integration in high-density networking equipment
-High-precision contact structure ensures stable and reliable optical signal transmission
-Excellent EMI shielding performance reduces interference in high-speed data environments
-Robust mechanical housing provides long-term durability and consistent connection reliability
Applications
1.High-Speed Data Communication Networks
2.Cloud Computing Infrastructure Systems
3.Telecommunication Transmission Equipment
4.Enterprise Networking Switches and Routers
Specifications
MECHANICAL :
CAGES: NICKEL SILVER ALLOY, THICKNESS 0.25MM.
CONNECTOR HOUSING: GLASS FILLED PLASTIC, 94 V-0, COLOR: BLACK.
OVERMOLDED TERMINAL HOUSING: GLASS FILLED PLASTIC, 94 V-0, COLOR: BLACK.
LIGHTPIPES: POLYCARBONITE, 94 V-0, COLOR: CLEAR.
LIGHTPIPE HOLDER: GLASS FILLED PLASTIC, 94 V-0, COLOR: BLACK.
CLIP: STAINLESS STEEL.
EMI SPRINC: COPPER ALLOY.
TERMINAL: POSPHRR BRONZE.
GOLD PLATING FOR CONTACT AREA, THICKNESS SEE OPTION.
TIN PLATING FOR PRESS FIT AREA.
NICKEL PLATING AS UNDERLAYER FOR WHOLE TERMINAL.
ELECTRICAL :
VOLTAGE: 30 VOLTS AC.
CURRENT: 0.50 A PER CONTACT.
CONTACT RESISTANCE: 50 MILLIOHMS MAX;
INSUL ATION RESISTANCE: 1000 MEGAOHMS MIN AT 100 VDC FOR 1 MINUTE.
DIELECTRIC WITHSTANDING VOLTAGE: 300 VDC MIN.
TEMPERATURE :
OPERATION: -40°C ~+85°C.
STORAGE: -55°C ~+105°C.
LIGHTPIPE PAD LAYOUT IS FOR LOW-PROFILE LED PACKAGE.
LED SIZE(LxWxH): 2x1xO.4MM MAX.
RoHS COMPLIANCE.
Technical Documents
Please contact us for more information.
SFP connector :RHTLYFP+09