EN
Features
-Solder mount design ensures strong mechanical and electrical connection stability on PCB
-Compact 1x1 structure supports efficient integration of QSFP+ optical modules in high-density systems
-Excellent EMI shielding enhances signal integrity in high-speed optical communication environments
-Durable metal cage construction provides long-term reliability and stable performance in data center applications
Applications
1.Data Center High-Speed Networking Systems
2.Cloud Computing Infrastructure
3.Telecommunication Equipment
4.Enterprise Switches and Routing Devices
Specifications
Material:
Shell: Copper Alloy, Nickel Plating 100u"
Operation Temperature: -40℃ ~ +105℃
Technical Documents
Please contact us for more information.
QSFP+ Cage 1x1 Solder Connector : RHTLYSFP+03