EN
Features
-30-position high-density design supports compact PCB layouts and multi-signal transmission
-Surface mount (SMD) structure enables efficient automated assembly and space-saving installation
-Excellent electrical performance ensures stable and reliable high-speed signal transmission
-Robust contact design provides strong durability and long-term connection stability in electronic systems
Applications
1.Consumer Electronics Devices
2.Industrial Control Systems
3.Telecommunication Equipment
4.Data Communication Systems
Specifications
Features:
Capable of 10Gbps data signal speeds 15 or 30-microinch gold plating.
High-speed contact design.
SMT design in tape reel or tray packaging.
Advanced stamping technology for smooth contact surface.
Material：
Insulators：Polyester Thermoplastics Glass Fibre Filled, UL 94V-0
Contact：Copper Alloy With Au Plated.
Electrical：
Contact Resistance：△R10 milliohms Max. for signal contacts
Insulation Resistance：1000MΩ Min. Current Rating：0.5 Amps Max. per contact
Mechanical：
Transceiver Insertion Force：40N Max.
Transceiver Extraction Force：30N Max.
Durability：100 Cycles Min.
Operating Temperature Range：-20°C to +85°C
Technical Documents
Please contact us for more information.
30Pos SMD Connector : RHTLY24FP-01